IEC 61837-2:2020 pdf download – Surface mounted piezoelectric devices for frequency control and selection – Standard outlines and terminal lead connections – Part 2: Ceramic enclosures.
1 Scope This part of IEC 61837 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016. 2 Normative references The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 61240:2016, Piezoelectric devices – Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection – General rules 3 Terms and definitions No terms and definitions are listed in this document. ISO and IEC maintain terminological databases for use in standardization at the following addresses: • • IEC Electropedia: available at http://www.electropedia.org/ ISO Online browsing platform: available at http://www.iso.org/obp 4 Configuration of enclosures The enclosures of the surface-mounted devices are made of ceramic materials with the terminals of deposited metal film (leadless type) based on a descriptive designation system for semiconductors – devices packages. The configuration symbols are shown as follows: • • DCC (dual chip carrier); QCC (quad chip carrier). 5 Designation of types The designation of types is shown on four parts as follows:
A: Configuration symbol of enclosures: – DCC (dual chip carrier); – QCC (quad chip carrier). B: Structure of terminal leads: leadless type has no mark. C: Number of terminal leads D: Serial number of both figures E: Arrangement of terminal land: In the case of DCC types: – A (arrangement in the width direction side or the width direction side and the corner); – B (arrangement in the length direction side or the length direction side and the corner); – C (arrangement in the corner only). In the case of QCC types: – A (arrangement in the side only); – B (arrangement in the side and the corner). 6 Ceramic enclosure dimensions The dimensions given in this document apply to all completed SMD-devices for frequency control and selection. Only those dimensions which meet the requirements of IEC 61240 are given. 7 Lead connections Recommendations for the lead connections of all completed SMD-devices for frequency control and selection are given in the following individual sheets. Lead connections shall always be given in the detail specification. 8 Designation of ceramic enclosures Table 1 is a list which includes all new enclosure types with their sheet numbers and brief descriptions. Old enclosure names are also listed as references.