IEC 60851 -1 :2021 pdf download – Winding wires – Test methods – Part 1: General.
1 Scope This part of IEC 60851 specifies the general notes on methods of test for winding wires. It also gives the definitions for terms used in IEC 60851 (all parts). A survey of the contents of IEC 60851 -2 to IEC 60851 -6 is given in Annex A. 2 Normative references The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 6031 7 (all parts), Specifications for particular types of winding wires IEC 60851 -2:2009 1 , Winding wires – Test methods – Part 2: Determination of dimensions IEC 60851 -2:2009/AMD1 :201 5 IEC 60851 -2:2009/AMD2:201 9 IEC 60851 -3:2009 2 , Winding wires – Test methods – Part 3: Mechanical properties IEC 60851 -3:2009/AMD1 :201 3 IEC 60851 -3:2009/AMD2:201 9 IEC 60851 -4:201 6, Winding wires – Test methods – Part 4: Chemical properties IEC 60851 -5:2008 3 , Winding wires – Test methods – Part 5: Electrical properties IEC 60851 -5:2008/AMD1 :201 1 IEC 60851 -5:2008/AMD2:201 9 IEC 60851 -6:201 2, Winding wires – Test methods – Part 6: Thermal properties 3 Terms, definitions and general notes on methods of test 3.1 Terms and definitions For the purposes of this document, the following terms and definitions apply.
3.2 General notes on methods of test Unless otherwise specified, all tests shall be carried out at a temperature from 1 5 °C to 40 °C and a relative humidity of 25 % to 75 %. Before measurements are made, the specimens shall be preconditioned under these atmospheric conditions for a time sufficient to allow the wire to reach stability. The wire to be tested shall be removed from the packaging in such a way that the wire will not be subjected to tension or to unnecessary bends. Before each test, sufficient wire shall be discarded to ensure that any damaged wire is not included in the test specimens. Normally, all mandatory requirements for a method of test are given in the description, and diagrams are intended only to illustrate one possible arrangement for conducting the test. In case of inconsistencies between the IEC 6031 7 specification sheet and this document, the specification sheet shall prevail. When the test is restricted only to certain types of winding wires, this is specified with the test. Those tests of IEC 60851 -2, IEC 60851 -3, IEC 60851 -4, IEC 60851 -5 and IEC 60851 -6 which in Annex A are marked with an asterisk are periodic conformance tests. These tests are carried out at a frequency agreed upon request of the end user. The test numbers used in IEC 60851 -2, IEC 60851 -3, IEC 60851 -4, IEC 60851 -5 and IEC 60851 -6 correspond with the clause numbers in the IEC 6031 7 series.
A.5 IEC 60851 -5 The contents shown below refers to IEC 60851 -5:2008, IEC 60851 -5:2008/AMD1 :201 1 and IEC 60851 -5:2009/AMD2:201 9. 1 Scope 2 Normative references 3 Test 5: Electrical resistance 4 Test 1 3: Breakdown voltage 4.1 Principle 4.2 Equipment 4.3 Enamelled round wire 4.4 Enamelled round wire with a nominal conductor diameter over 0,1 00 mm and up to and including 2,500 mm, grade 1 to grade 3 4.5 Round wire with a nominal conductor diameter over 2,500 mm 4.6 Fibre wound round wire 4.7 Rectangular wire 5 Test 1 4: Continuity of insulation (applicable to enamelled round and tape wrapped round wire) 5.1 General 5.2 Low-voltage continuity (nominal conductor diameter up to and including 0,050 mm, grade 1 to grade 3) 5.3 High-voltage continuity (nominal conductor diameter over 0,050 mm up to and including 1 ,600 mm, grade 1 to grade 3, and over 0,035 mm, up to and including 1 ,600 mm, grade 3 of FIW 3 to FIW 9) 5.4 Inline high-voltage continuity (wires in accordance with grade of FIW 3 to FIW 1 0 with nominal conductor diameter over 0,035 mm up to and including 1 ,600 mm) 6 Test 1 9*: Dielectric dissipation factor (applicable to enamelled round wire and bunched wire) 6.1 Principle 6.2 Equipment 6.3 Specimen 6.4 Procedure 6.5 Result 7 Test 23: Pin hole test Annex A (informative) Dissipation factor methods