IEC 63287-1 :2021 pdf download – Semiconductor devices – Generic semiconductor qualification guidelines – Part 1: Guidelines for IC reliability qualification.
2 Normative references The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60749-5, Semiconductor devices – Mechanical and climatic test methods – Part 5: Steady-state temperature humidity bias life test IEC 60749-6, Semiconductor devices – Mechanical and climatic test methods – Part Storage at high temperature IEC 60749-1 5, Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices IEC 60749-20, Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat IEC 60749-21 , Semiconductor devices – Mechanical and climatic test methods – Part 21: Solderability IEC 60749-23, Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life IEC 60749-25, Semiconductor devices – Mechanical and climatic test methods – Part 25: Temperature cycling
3 Terms and definitions For the purposes of this document, the following terms and definitions apply. ISO and IEC maintain terminological databases for use in standardization at the following addresses: • IEC Electropedia: available at http://www.electropedia.org/ • ISO Online browsing platform: available at http://www.iso.org/obp 3.1 failure mode classification of a fault phenomenon which causes product failure Note 1 to entry: Disconnection, a short circuit, occasional loss, abrasion, characteristic deterioration, etc. are typical items considered as failure modes. 3.2 failure mechanism physical, chemical or other process that results in a product failure to meet functional requirements (or failure modes) 3.3 integrated circuit IC microcircuit in which all or some of the circuit elements are inseparably associated and electrically interconnected so that it is considered to be indivisible for the purpose of construction and commerce Note 1 to entry: IEV:521 -1 0-03 4 Product categories and applications Quality-related requirements, operating hours, and field operating condition of ICs depend on the applications of products in which they are used. As an example of creating scientific test plans, their applications are broadly classified into three product categories: Automotive Use A; Automotive Use B; and Consumer Use. Table 1 shows a list of quality-related requirements according to each product category and the definition of their use conditions.
Random failure has been considered to achieve a certain failure rate with respect to time, but actually, it is appropriate to consider as an extension of the early failure region where the failure rate continues to decline. Potentially induced failures outside of the supplier’s control, such as ESD, EOS and soft errors, should not be included in the failure rate calculations unless a total fail rate that includes these types of fail modes is intended. Wear-out failure is a failure which occurs due to the end of life of IC components such as transistors and interconnections, and indicates the life of the ICs themselves. Wear-out failure is a failure which depends on the usage load profile (time windows may be different). The number of failures increases with time, and every IC will eventually cause a failure beyond the intended design life of the part. Wear-out failures are not considered in the same manner, because they have a totally different mechanism and therefore also a different mathematical description (failure distribution). Therefore, it is important to prevent this failure during the durable period. For ICs, the time to reach the cumulative failure probability of 0,1 5 over the design life of the part in the given application is generally defined as their design lifetime.